Van der Plas, Geert: search on Z-Library

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1

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Oprins, Herman, Cherman, Vladimir, Webers, Tomas, Salahouelhadj, Abdellah, Kim, Soon-Wook, Peng, Lan, Van der Plas, Geert, Beyne, Eric

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.67 MB

english, 2017

2

Factor analysis of plasma-induced damage in bulk FinFET technology

Hiblot, Gaspard, Van der Plas, Geert

Journal:

IEEE Electron Device Letters

Year:

2018

Language:

english

File:

PDF, 1.02 MB

english, 2018

3

Electrical characterization of BEOL Plasma-Induced Damage in bulk FinFET technology

Hiblot, Gaspard, Subirats, Alexandre, Liu, Yefan, Van der Plas, Geert

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2018

Language:

english

File:

PDF, 689 KB

english, 2018

4

[IEEE 2011 IEEE Custom Integrated Circuits Conference - CICC 2011 - San Jose, CA, USA (2011.09.19-2011.09.21)] 2011 IEEE Custom Integrated Circuits Conference (CICC) - DRAM-on-logic Stack – Calibrated thermal and mechanical models integrated into PathFinding flow

Milojevic, Dragomir, Oprins, Herman, Ryckaert, Julien, Marchal, Paul, Van der Plas, Geert

Year:

2011

Language:

english

File:

PDF, 1.85 MB

english, 2011

5

Full-Loop Equivalent Circuit Model for Plasma-Induced Damage Simulation

Hiblot, Gaspard, Van der Plas, Geert

Journal:

IEEE Transactions on Plasma Science

Year:

2018

Language:

english

File:

PDF, 1002 KB

english, 2018

6

Performance and Reliability Impact of Copper Plasticity in Backside TSV-last Fabrication Process

Karmarkar, Aditya, Guo, Wei, Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2016

Language:

english

File:

PDF, 1.53 MB

english, 2016

7

A study on substrate noise coupling among TSVs in 3D chip stack

Araga, Yuuki, Nagata, Makoto, De Vos, Joeri, Van der Plas, Geert, Beyne, Eric

Journal:

IEICE Electronics Express

Year:

2018

Language:

english

File:

PDF, 3.01 MB

english, 2018

8

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions

Van der Plas, Geert, Thijs, Steven, Linten, Dimitri, Katti, Guruprasad, Limaye, Paresh, Mercha, Abdelkarim, Stucchi, Michele, Oprins, Herman, Vandevelde, Bart, Minas, Nikolas, Cupac, Miro, Dehan, Mori

Year:

2010

Language:

english

File:

PDF, 877 KB

english, 2010

9

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress

Gonzalez, Mario, De Vos, Joeri, Van der Plas, Geert, Beyne, Eric

Year:

2015

Language:

english

File:

PDF, 2.44 MB

english, 2015

10

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Improved Staggered Through Silicon Via Inductors for RF and Power Applications

Sun, Xiao, Van der Plas, Geert, Beyne, Eric

Year:

2018

Language:

english

File:

PDF, 577 KB

english, 2018

11

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Comparative Analysis of the Degradation Mechanisms in Logic and I/O FinFET Devices Induced by Plasma Damage

Hiblot, Gaspard, Liu, Yefan, Hellings, Geert, Van der Plas, Geert

Year:

2019

Language:

english

File:

PDF, 3.15 MB

english, 2019

12

[IEEE ESSCIRC 2007 - 33rd European Solid-State Circuits Conference - Sevilla, Spain (2010.09.14-2010.09.16)] 2010 Proceedings of ESSCIRC - A 100kHz–10MHz BW, 78-to-52dB DR, 4.6-to-11mW flexible SC ΣΔ modulator in 1.2-V 90-nm CMOS

Morgado, Alonso, del Rio, Rocio, de la Rosa, Jose M., Bos, Lynn, Ryckaert, Julien, Van der Plas, Geert

Year:

2010

Language:

english

File:

PDF, 1.66 MB

english, 2010

13

Anomalous ${C}$ – ${V}$ Inversion in TSVs: The Problem and Its Cure

Stucchi, Michele, De Vos, Joeri, Jourdain, Anne, Li, Yunlong, Van Der Plas, Geert, Croes, Kristof, Beyne, Eric

Journal:

IEEE Transactions on Electron Devices

Year:

2018

Language:

english

File:

PDF, 2.30 MB

english, 2018

14

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Oprins, Herman, Cherman, Vladimir, Van der Plas, Geert, De Vos, Joeri, Beyne, Eric

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 5.72 MB

english, 2016

15

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route

Sisto, Giuliano, Debacker, Peter, Chen, Rongmei, Van Der Plas, Geert, Chou, Richard, Beyne, Eric, Milojevic, Dragomir

Year:

2019

File:

PDF, 4.61 MB

2019

16

[IEEE 2010 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2010.02.7-2010.02.11)] 2010 IEEE International Solid-State Circuits Conference - (ISSCC) - A 2.6mW 6b 2.2GS/s 4-times interleaved fully dynamic pipelined ADC in 40nm digital CMOS

Verbruggen, Bob, Craninckx, Jan, Kuijk, Maarten, Wambacq, Piet, Van der Plas, Geert

Year:

2010

Language:

english

File:

PDF, 314 KB

english, 2010

17

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - 3D technology roadmap and status

Marchal, Paul, Van der Plas, Geert, Eneman, Geert, Moroz, Victor, Badaroglu, Mustafa, Mercha, Abdelkarim, Thijs, Steven, Linten, Dimitri, Guruprasad, Katti, Stucchi, Michele, Vandevelde, Bart, O'Prins

Year:

2011

Language:

english

File:

PDF, 1.12 MB

english, 2011

18

Mauritius since the last glacial: environmental and climatic reconstruction of the last 38 000 years from Kanaka Crater

Geert W. Van Der Plas, Erik J. De Boer, Henry Hooghiemstra, F. B. Vincent Florens, Claudia Baider, Johannes Van Der Plicht

Journal:

Journal of Quaternary Science

Year:

2012

Language:

english

File:

PDF, 871 KB

english, 2012

19

[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - TSV process-induced MOS reliability degradation

Li, Yunlong, Stucchi, Michele, Van Huylenbroeck, Stefaan, Van Der Plas, Geert, Beyer, Gerald, Beyne, Eric, Croes, Kristof

Year:

2018

Language:

english

File:

PDF, 808 KB

english, 2018

20

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Marchal, Paul, Libois, Michael, Manna, Antonio La, Zhang, Wenqi, Beyer, Gerald, Beyne, Eric

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 3.79 MB

english, 2014

21

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Thermal stability of copper Through-Silicon Via barriers during IC processing

Civale, Yann, Croes, Kristof, Miyamori, Yuichi, Thangaraju, Sarasvathi, Redolfi, Augusto, Van Ammel, Annemie, Velenis, Dimitrios, Cherman, Vladimir, Hendrickx, Paul, Van der Plas, Geert, Cockburn, And

Year:

2011

Language:

english

File:

PDF, 356 KB

english, 2011

22

[IEEE 2010 IEEE Radio Frequency Integrated Circuits Symposium - Anaheim, CA, USA (2010.05.23-2010.05.25)] 2010 IEEE Radio Frequency Integrated Circuits Symposium - A 6.1 GS/s 52.8 mW 43 dB DR 80 MHz bandwidth 2.4 GHz RF bandpass ΔΣ ADC in 40 nm CMOS

Ryckaert, Julien, Geis, Arnd, Bos, Lynn, Van der Plas, Geert, Craninckx, Jan

Year:

2010

Language:

english

File:

PDF, 372 KB

english, 2010

23

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

Guo, Wei, Karmarkar, Aditya P., Xu, Xiaopeng, Van der Plas, Geert, Van Huylenbroeck, Stefaan, Gonzalez, Mario, Absil, Philippe, El Sayed, Karim, Beyne, Eric

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

24

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - RF characterization of mold compound materials and high-$Q$ integrated passives using fan-out wafer-level packaging technology

Sun, Xiao, Slabbekoorn, John, Velenis, Dimitrios, Miller, Andy, Van der Plas, Geert, Beyne, Eric

Year:

2019

File:

PDF, 1.97 MB

2019

25

Gibberellin and phytochrome control senescence in alstroemeria leaves independently

Iris F. Kappers, Wilco Jordi, Frank M. Maas, Geert M. Stoopen, Linus H. W. Van Der Plas

Journal:

Physiologia Plantarum

Year:

1998

File:

PDF, 589 KB

1998

26

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Technology optimization for high bandwidth density applications on 3D interposer

Pantano, Nicolas, Neve, Cesar Roda, Van der Plas, Geert, Detalle, Mikael, Verhelst, Marian, Heyns, Marc, Beyne, Eric

Year:

2016

Language:

english

File:

PDF, 603 KB

english, 2016

27

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Integrated magnetic cores in FOWLP and their applications

Sun, Xiao, Slabbekoorn, John, Velenis, Dimitrios, Bex, Pieter, Duval, Fabrice, Sterken, Tom, Talmelli, Giacomo, de Preter, Inge, Webers, Tomas, Adelmann, Christoph, Miller, Andy, Van der Plas, Geert,

Year:

2020

File:

PDF, 679 KB

2020

28

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - A High-Bandwidth Fine-Pitch 2.57Tbps/mm In-package Communication Link Achieving 48fJ/bit/mm Efficiency

Pantano, Nicolas, Van der Plas, Geert, Bex, Pieter, Nolmans, Philip, Velenis, Dimitrios, Verhelst, Marian, Beyne, Eric

Year:

2019

Language:

english

File:

PDF, 3.66 MB

english, 2019

29

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration

Jourdain, Anne, Schleicher, Filip, De Vos, Joeri, Stucchi, Michele, Chery, Emmanuel, Miller, Andy, Beyer, Gerald, Van der Plas, Geert, Walsby, Edward, Roberts, Kerry, Ashraf, Huma, Thomas, Dave, Beyne

Year:

2020

File:

PDF, 973 KB

2020

30

SPIE Proceedings [SPIE Microtechnologies for the New Millennium 2005 - Sevilla, Spain (Monday 9 May 2005)] VLSI Circuits and Systems II - Substrate noise coupling: a pain for mixed-signal systems (Keynote Address)

Wambacq, Piet, Van der Plas, Geert, Donnay, Stephane, Badaroglu, Mustafa, Soens, Charlotte, Lopez, Jose F., Fernandez, Francisco V., Lopez-Villegas, Jose Maria, de la Rosa, Jose M.

Year:

2005

Language:

english

File:

PDF, 447 KB

english, 2005

31

The Potential of FinFETs for Analog and RF Circuit Applications

Wambacq, Piet, Verbruggen, Bob, Scheir, Karen, Borremans, Jonathan, Dehan, Morin, Linten, Dimitri, De Heyn, Vincent, Van der Plas, Geert, Mercha, Abdelkarim, Parvais, Bertrand, Gustin, Cedric, Subrama

Journal:

IEEE Transactions on Circuits and Systems I: Regular Papers

Year:

2007

Language:

english

File:

PDF, 2.68 MB

english, 2007

32

Advanced experimental back-end-of-line (BEOL) stability test: Measurements and simulations

Vanstreels, Kris, Cherman, Vladimir, Gonzalez, Mario, De Wolf, Ingrid, Van der Plas, Geert, De Vos, Joeri, Bömmels, Jürgen, Tőkei, Zsolt

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 2.42 MB

english, 2015

33

[IEEE 2015 International Conference on Microelectronic Test Structures (ICMTS) - Tempe, AZ, USA (2015.3.23-2015.3.26)] Proceedings of the 2015 International Conference on Microelectronic Test Structures - In-line monitoring test structure for Charge-Based Capacitance Measurement (CBCM) with a start-stop self-pulsing circuit

Sawada, Ken, Van der Plas, Geert, Mori, Shigetaka, Vladimir, Cherman, Mercha, Abdelkarim, Diederik, Verkest, Fukuzaki, Yuzo, Ammo, Hiroaki

Year:

2015

Language:

english

File:

PDF, 1.38 MB

english, 2015

34

[IEEE 2008 International Solid-State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2008.02.3-2008.02.7)] 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers - A 2.2mW 5b 1.75GS/s Folding Flash ADC in 90nm Digital CMOS

Verbruggen, Bob, Craninckx, Jan, Kuijk, Maarten, Wambacq, Piet, Van der Plas, Geert

Year:

2008

Language:

english

File:

PDF, 1.72 MB

english, 2008

35

[IEEE 2010 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsin Chu, Taiwan (2010.04.26-2010.04.29)] Proceedings of 2010 International Symposium on VLSI Design, Automation and Test - Verifying thermal/thermo-mechanical behavior of a 3D stack - challenges and solutions

Marchal, Paul, Van der Plas, Geert, Limaye, Paresh, Mercha, Abdelkarim, Cherman, Vladimir, O'Prins, Herman, Labie, Riet, Vandevelde, Bart, Travaly, Youssef, Beyne, Eric

Year:

2010

Language:

english

File:

PDF, 410 KB

english, 2010

36

[ACM Press the conference - Munich, Germany (2008.03.10-2008.03.14)] Proceedings of the conference on Design, automation and test in Europe - DATE '08 - Mixed-signal design space exploration of time-interleaved A/D converters for ultra-wide band applications

Nuzzo, Pierluigi, Nani, Claudio, Fanucci, Luca, Saponara, Sergio, Van der Plas, Geert

Year:

2008

Language:

english

File:

PDF, 265 KB

english, 2008

37

Ring transformations in reactions of heterocyclic halogeno compounds with nucleophiles (XXXIII): NMR evidence for the occurrence of σ-addition complexes in reactions of 4-chloropyrimidines with potassium amide in liquid ammonia(Preliminary Communication)

J. P. Geerts, H. C. van der Plas, A. van Veldhuizen

Journal:

Recueil des Travaux Chimiques des Pays-Bas

Year:

1973

Language:

english

File:

PDF, 186 KB

english, 1973

38

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study

Milojevic, Dragomir, Carlson, Trevor E., Croes, Kris, Radojcic, Riko, Ragett, Diana F., Seynhaeve, Dirk, Angiolini, Federico, Van der Plas, Geert, Marchal, Pol

Year:

2009

Language:

english

File:

PDF, 799 KB

english, 2009

39

[IEEE 2008 IEEE Symposium on VLSI Circuits - Honolulu, HI, USA (2008.06.18-2008.06.20)] 2008 IEEE Symposium on VLSI Circuits - A 7.6 mW 1.75 GS/s 5 bit flash A/D converter in 90 nm digital CMOS

Verbruggen, Bob, Wambacq, Piet, Kuijk, Maarten, Van der Plas, Geert

Year:

2008

Language:

english

File:

PDF, 169 KB

english, 2008

40

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Improved Staggered Through Silicon Via Inductors for RF and Power Applications

Sun, Xiao, Van der Plas, Geert, Beyne, Eric

Year:

2018

File:

PDF, 577 KB

2018

41

Adventitious regeneration from tulip, lily and apple expiants at different oxygen levels

Maarten W.P.C. van Rossum, Geert-Jan M. De Klerk, Linus H.W. van der Plas

Journal:

Journal of Plant Physiology

Year:

1998

Language:

english

File:

PDF, 538 KB

english, 1998

42

[IEEE 2009 Proceedings of ESSCIRC (ESSCIRC) - Athens, Greece (2009.09.14-2009.09.18)] 2009 Proceedings of ESSCIRC - A single bit 6.8mW 10MHz power-optimized continuous-time ΔΣ with 67dB DR in 90nm CMOS

Crombez, Pieter, Van der Plas, Geert, Steyaert, Michiel, Craninckx, Jan

Year:

2009

Language:

english

File:

PDF, 1.29 MB

english, 2009

43

[IEEE 2013 IEEE International Solid-State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2013.02.17-2013.02.21)] 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers - Session 15 overview: Data converter techniques

Perrott, Michael, van der Plas, Geert

Year:

2013

Language:

english

File:

PDF, 97 KB

english, 2013

44

[IEEE 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) - Reno, NV, USA (2015.9.27-2015.10.2)] 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) - ESD protection design in active-lite interposer for 2.5 and 3D systems-in-package

Scholz, Mirko, Hellings, Geert, Chen, Shih-Hung, Linten, Dimitri, Detalle, Mikael, Neve, Cesar Roda, Shibkov, A., La Manna, Antonio, van der Plas, Geert, Beyne, Eric

Year:

2015

Language:

english

File:

PDF, 470 KB

english, 2015

45

[IEEE 2011 International Conference on Microelectronic Test Structures (ICMTS) - Amsterdam, Netherlands (2011.04.4-2011.04.7)] 2011 IEEE ICMTS International Conference on Microelectronic Test Structures - An efficient array structure to characterize the impact of through silicon vias on FET devices

Perry, Dan, Cho, Jonghoon, Domae, Shinichi, Asimakopoulos, Panagiotis, Yakovlev, Alex, Marchal, Pol, Van der Plas, Geert, Minas, Nikolaos

Year:

2011

Language:

english

File:

PDF, 532 KB

english, 2011

46

[IEEE 2008 International Solid-State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2008.02.3-2008.02.7)] 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers - A 150MS/s 133¿W 7b ADC in 90nm digital CMOS Using a Comparator-Based Asynchronous Binary-Search sub-ADC

Van der Plas, Geert, Verbruggen, Bob

Year:

2008

Language:

english

File:

PDF, 542 KB

english, 2008

47

[IEEE 2008 Design, Automation and Test in Europe - Munich, Germany (2008.03.10-2008.03.14)] 2008 Design, Automation and Test in Europe - Mixed-Signal Design Space Exploration of Time-Interleaved A/D Converters for Ultra-Wide Band Applications

Nuzzo, Pierluigi, Nani, Claudio, Saponara, Sergio, Fanucci, Luca, Van der Plas, Geert

Year:

2008

Language:

english

File:

PDF, 383 KB

english, 2008

48

ECS Transactions [ECS 220th ECS Meeting - Boston, MA (October 9 - October 14, 2011)] - Low-Frequency Noise Assessment of CMOS Transistors with a Through-Silicon Via

Simoen, Eddy, Mercha, Abdelkarim, Van der Plas, Geert, Claeys, Cor

Year:

2011

Language:

english

File:

PDF, 1.15 MB

english, 2011

49

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Chip package interaction: A stress analysis on 3D IC's packages

Lofrano, Melina, Gonzalez, Mario, Wei Guo,, Van der Plas, Geert

Year:

2015

Language:

english

File:

PDF, 2.20 MB

english, 2015

50

[IEEE 2015 International Conference on Microelectronic Test Structures (ICMTS) - Tempe, AZ, USA (2015.3.23-2015.3.26)] Proceedings of the 2015 International Conference on Microelectronic Test Structures - A novel structure of MOSFET array to measure ioff-ion with high accuracy and high density

Suzuki, Tsuyoshi, Anchlia, Ankur, Cherman, Vladimir, Oishi, Hidetoshi, Mori, Shigetaka, Ryckaert, Julien, Ogawa, Kazuhisa, Van der Plas, Geert, Beyne, Eric, Fukuzaki, Yuzo, Verkest, Diederik, Ohnuma,

Year:

2015

Language:

english

File:

PDF, 1.53 MB

english, 2015

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